HCL Lasers Launches Two Devices at Chinaplas

Wuhan Huagong Laser Engineering Co., Ltd. recommended the mold welding machine and semiconductor laser marking machine to the audience at the recent 2005 China International Rubber and Plastic Exhibition held in Guangzhou.

HGL-LWM100/200 laser die welding machine is a special model tailored for the mould industry by relying on the laser welding equipment development and production experience accumulated in the mould industry for many years. The machine is particularly suitable for the repair of precision molds, has been successfully used in automotive, machinery manufacturing, mobile phones, glass, plastics and other areas of rubber molds, glass molds, mechanical molds, blanking die welding and repair.

The DW5600 semiconductor-pumped solid-state laser marking machine is a device co-produced by HGLASER, Fuji Electric (Japan) and MIYACHI Corporation. DW5600 semiconductor-pumped solid-state laser marking machine is gradually replacing the lamp-pumped solid-state laser marking machine for its advantages of high reliability, long service life, high energy conversion efficiency, and good beam quality. It is widely used in electronic components and electricians. Products, integrated circuits, hardware tools, auto parts, plastic products, precision instruments, and many other fields.